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ChipX: 300-Day VLSI Engineering Roadmap

One SoC, eleven stages — layman to DRDO / ISRO / BARC / BEL and global VLSI companies.

A day-by-day path from device physics and CMOS logic through RTL design, verification, FPGA prototyping, ASIC implementation, and tapeout — building one product, the ChipX RV32I SoC, all the way to a DRC/LVS-clean Sky130 GDSII and a Tiny Tapeout submission, on an honest open-source toolchain.

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S−1 · Days 1–8

Sand to Silicon

Fab, packaging, yield, and device physics — shipping a fab-to-package note, a die-per-wafer worksheet, and measured diode/MOSFET I–V curves.

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S0 · Days 9–33

CMOS Fundamentals + Digital Logic

From transistors to gates you can draw, build, and time — shipping a measured CMOS inverter VTC, a Python gate-level simulator, and three breadboard builds.

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S1 · Days 34–55

Computer Organization & the RISC-V ISA

Understand the machine ChipX will become — shipping an RV32I instruction-set simulator (the golden reference model) and the full paper pipeline design.

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S2 · Days 56–95

Verilog RTL Design

Translate the paper CPU into synthesizable RTL and build every peripheral — shipping a pipelined RV32I core passing riscv-tests plus UART/SPI/I²C/GPIO/timer and FIFOs.

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ChipX: 300-Day VLSI Engineering Roadmap

Foundations → RTL ReadyDays 1–95Sand-to-silicon device physics, CMOS & digital logic, the RISC-V machine, then synthesizable Verilog. Day-95 off-ramp: a pipelined RV32I core that passes riscv-tests — RTL-design interviewable.0/95

Verification & FPGADays 96–180An industry-shape UVM environment with coverage closure, then ChipX leaves simulation and boots your C code on a real FPGA. Day-180 off-ramp: DV-strong and FPGA-proven.0/85

Silicon, Tapeout & DefenseDays 181–300ASIC front-end, physical design to a DRC/LVS-clean GDSII, signoff and a Tiny Tapeout submission, a DRDO/defense accelerator portfolio, and the interview freeze. Day-300: taped out and DRDO-ready.0/120

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